Small Passives Rework

01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution including component re-alignment or removal, site cleaning and optional paste application and replacement with the industries best optical resolution – incorporating real-time inspection during the process.

01005 small passive components
Comparison 01005 to 0201 small passives
Tombstoned small passive component
Rotated 01005 small passive

What are the challenges?

Repair of components with any kind of defect: tomb-/book-stoned, cracked, missing, misplaced or rotated
“All-in-one” solution for all process steps
Difficulty seeing component with sufficient magnification and optical resolution
Capable to allow in-situ process observation of the working area
Secure component handling process from pick up from tape presentation to placement, controlling fragile components with very low mass (0.04g/1000 pcs.)
Force-controlled handling and placement throughout the whole rework process
Compensation of heat expansion by force balance
Removing the target component without disturbing its neighbors
Placing new components with at least 10 µm accuracy
Solder paste dispensing or solder paste transfer with typical dots of about 200 µm dia.
Tool design to allow access to densely assembled components with small clearance

The Finetech Solution

Remove, Clean, Dispense or Print Solder Paste, Place, Reflow

Desoldering a 01005
Desoldering a 01005
Small passive removal
Small passive removal
Removed component
Dispensed solder paste dots
Pick up new component from strip

Finetech offers a conprehensive solution to perform the whole rework cycle within one system:

Remove contactless
Clean contactless
Dispense or print solder paste
Place new component
Reflow component

Video Equipment for Optical Precision Alignment and Real Time Inspection

Optical overlay for precision alignment
Side view with process cam

Sufficient magnification and optical resolution for optical alignment and component visibility in excellent quality
Process camera provides in-situ visual feedback during all rework steps

Secure Component Handling

Pick up from strip
Pick up from strip

Ceramic capacitors are very fragile and temperature- and force sensitive
Adapted tool design
Module for strip/tape presentation of new components
Controlled temperature processes and force-control throughout the whole process

Adapted Tooling

Tool for 01005 with inert gas support

Highly precise tools with vacuum support for secure handling
Designed to compensate thermal expansion effects
Provides very localized top heat input to avoid disturbance of neighboured components
Inert gas support provides process atmosphere adequate to reflow oven conditions
Tool design allows access to densely assembled components with small clearance

Integrated Process Management (IPM)

Integrated Process Management (IPM)
Principle of process gas integration
Operating software for rework

The Integrated Process Management (IPM) is the center piece of a FINEPLACER^® system¹ - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:

Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
Control of temperature, time, force, power, energy, flow
Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues

IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.

The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control.

In combination with the system-to-system process transfer capability this is as easy as process development can get.

¹ _{FINEPLACER^® core offers co-ordinated top and bottom heating but does not support IPM}