01005 and 008004 Rework

008004 and 01005 small passive components are becoming more and more important these days (integration, miniaturisation, etc.). They allow particularly flat package designs when developing ultra mobile electronic products such as functional modules, very small or sensitive sensors, active electronic micro implants for biomedical applications, or wearables.

Finetech offers a complete solution including component re-alignment or removal, site cleaning and optional paste application and replacement with the industries best optical resolution – incorporating real-time inspection during the process.

  • 01005 and 008004 small passive components
  • Comparison 01005 to 0201 small passives
  • Tombstoned small passive component
  • Rotated 01005 small passive

What are the challenges?

  • Repair of components with any kind of defect: tomb-/book-stoned, cracked, missing, misplaced or rotated
  • “All-in-one” solution for all process steps
  • Difficulty seeing component with sufficient magnification and optical resolution
  • Capable to allow in-situ process observation of the working area
  • Secure component handling process from pick up from tape presentation to placement, controlling fragile components with very low mass, avoid electrostatic charging
  • Force-controlled handling and placement throughout the whole rework process
  • Compensation of heat expansion by force balance
  • Removing the target component without disturbing its neighbors
  • Placing new components with at least 10 µm accuracy
  • Solder paste dispensing or solder paste transfer with typical dots of about 50-100 µm dia
  • Tool design to allow access to densely assembled components with small clearance
  • Reliable vacuum component detection at the tool
  • Preventing tool vacuum openings from clogging

Rework of a 01005 Passive - Process Steps

  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • Flash is required!
  • 1st - Desoldering: The defect components has to be de-soldered without affecting adjacent components. An optimized optical resolution, sufficient magnification, adapted tool design as well as precisely adjusted heat input is required to manage this.
  • 2nd - Residual solder removal: Residual solder will be removed contactless by using a specialized vacuum-based solder removal head. Again, a main challenge is to avoid harm of neighbored components even with tiny clearances like this. Use the process camera for real-time multi-angle perspective visual feedback of the solder removal step and the entire rework process.
  • 3rd - Dispensing: A dispensing unit is used to apply fresh solder material onto the PCB contact pads.
  • 4th - The result: As you can see in the video, the solder paste can be applied with highest accuracy and precisely dosed.
  • 5th - Pick-up: Usually, the new component will be picked up from a strip or tape. A dedicated component presentation module makes picking up the chip a breeze. Pick up and solder in the 01005 small passive using the same tool.
  • 6th - Reflow: The 01005 component is soldered in with software-controlled local heat input (optionally employing nitrogen) and optimal force control for maximum safety and reliable results.

The Finetech Solution

Remove, Clean, Dispense or Print Solder Paste, Place, Reflow

  • Desoldering a 01005
  • Desoldering a 01005
  • Small passive removal
  • Small passive removal
  • Removed component
  • Dispensed solder paste dots
  • Pick up new component from strip

Finetech offers a comprehensive solution to perform the whole rework cycle within one system:

  • Remove contactless
  • Clean contactless
  • Dispense or print solder paste (50 µm - 100 µm dia. for 008004 components)
  • Place new component
  • Reflow component: create inert atmosphere to prevent oxidation and maintain surface wetting ability, controlled thermal input to soldering joint and component to avoid thermal distortions

Controlled Mixed Soldering System

  • Flash is required!

  • Controlled Mixed Soldering System

Finetech’s unique thermal management concept uses “cold” air or gas (typically nitrogen) introduced into the hot-gas stream in a mixing chamber. The chamber location is just before the air passes through the nozzle onto the component. This gas mixture results in a highly responsive system - reducing over and under-shoot to barely perceptible levels. Tracking of the pre-set temperature is optimized and when combined with mass-flow-control of gas volumes (up to 70L/min), produces an effective heat delivery system. Heater lifetime is also increased and system-to-system reproducibility is greatly enhanced (±2ºC).

Video Equipment for Optical Precision Alignment and Real Time Inspection

  • Optical overlay for precision alignment
  • Side view with process cam
  • Sufficient magnification and optical resolution for optical alignment and component visibility in excellent quality
  • Process camera provides in-situ visual feedback during all rework steps

Secure Component Handling

  • Pick up from strip
  • Pick up from strip
  • Ceramic capacitors are very fragile and temperature- and force sensitive
  • Adapted tool design
  • Module for strip/tape presentation of new components
  • Controlled temperature processes and force-control throughout the whole process

Adapted Tooling

  • Tool for 01005 with inert gas support
  • Highly precise tools with vacuum support for secure handling
  • Designed to compensate thermal expansion effects
  • Provides very localized top heat input to avoid disturbance of neighboured components
  • Inert gas support provides process atmosphere adequate to reflow oven conditions
  • Tool design allows access to densely assembled components with small clearance

Integrated Process Management (IPM)

  • Integrated Process Management (IPM)
  • Principle of process gas integration
  • Operating software for rework

The Integrated Process Management (IPM) is the center piece of a FINEPLACER® system1 - the place where it all comes together. IPM is more than just thermal management. It synchronizes the control of all process modules and their related parameters:

  • Controlled and precisely balanced interaction of top and bottom (pre-)heating and cooling
  • Control of temperature, time, force, power, energy, flow
  • Process-integrated camera and light control
  • Controlled process gas integration for reduced solder contamination, minimized surface tension effects and smooth spherical solder residues

 IPM is very complex, yet easy to access. Via the GUI of the operating software, the user has perfect control of all required adjustments. Just drag 'n drop to define temperature ramps or activate process modules. All settings are represented in only one profile, making for a very intuitive work flow.
 
The operating software provides an ever-growing library of profiles for all kinds of processes. It also offers comprehensive data logging functions essential for statistical process control.

In combination with the system-to-system process transfer capability this is as easy as process development can get.

1 FINEPLACER® core offers co-ordinated top and bottom heating but does not support IPM

FINEPLACER® Rework Systems

  • FINEPLACER® coreplus
    Rework of medium-sized boards
  • FINEPLACER® pico rs
    High density rework station
  • FINEPLACER® micro rs
    Hot air SMD rework station

Amongst other factors, the recommended system mainly depends on size and pitch of your component and the required process flexiblity.

Browse our product range or get in contact with your sales contact to figure out the best equipment solution for your needs.

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