June 25-27, 2013Location: China National Convention Center, BeijingBooth: tba.On display: tba.
Aug 11-14, 2013Location: Dalian, ChinaBooth: tba.On display: tba.
Sep 4-6, 2013Location: TWCT Nangang Exhibition Hall, TaiwanBooth: tba.On display: tba.
Sep. 6-9, 2013Location: Shenzhen Convention and Exhibition Center, Shenzhen, ChinaBooth: tba.On display: FINEPLACER® lambda
Sep 9-12, 2013Location: EUROPOLE WTC Congress Center, GrenobleBooth: tba.On display: FINEPLACER® lambda
Sep 19-21, 2013Location: MARITIM Hotel & Congress Centrum, BremenOn display: tba.
Sep 22-26, 2013Location: ICC London ExCel, UKBooth: tba.On display: FINEPLACER® lambda
Oct 1-3, 2013Location: Orlando, FL
Oct 15-16, 2013Location: Ft. Worth, TX
Nov 12-15, 2013Location: New Munich Trade Fair Centre, GermanyBooth: tba.On display: FINEPLACER® lambda
Finetech is pleased to announce new partnerships with Coltronics from Australia and Altrade Comércio e Representações from Brazil.
A FINEPLACER® pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
In January 2013, Finetech proudly handed over the 2000 FINEPLACER® bonding system. The Russian Institute for High Energy Physics will now work with a FINEPLACER® lambda.
A newly developed positioning table motorization for FINEPLACER® matrix largely enhances the machine's capabilities with regard to automatic solder removal and dispensing...
The FINEPLACER® core is an entry model for professional SMD rework that has already made a name of itself for being a cost-efficient all-round system with a broad spectrum of...
Solid state lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. They combine the valuable physical characteristics of...
The assembly and packaging of optoelectronic devices is one of the key applications in the division of micro assembly. Dense packaged multiplex transmitters, receivers and...
Optical packages are comprising optical and electronic components.
Flexible substrates are used in 3D connection and mechatronic concepts for reducing the number of connectors needed. They can stand high dynamic bending and ...
01005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.). Finetech offers a complete solution
BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but ...